MEMS微机电原件

简介

The manufacturing process of MEMS devices includes proximity or contact lithography to generate micro machined mechanical features. With most device types a double-side lithography step, in which the front side pattern needs to be precisely aligned to the back side, is required. EV Group offers lithography systems with special configurations to suit the MEMS manufacturing requirements.

Featuring moving components   at a micron scale, many MEMS devices require silicon wafer bonding - for example, silicon or glass bonding - as a method to hermetically seal and encapsulate the device in order to create a first-level package. The EV Group Wafer bonding systems are designed for volume manufacturing of MEMS and perform all wafer bonding techniques utilizing EV Group's unique process separation principle. Modular configurations facilitate the transfer of R&D processes to production, and the equipment supports various wafer sizes and materials. EV Group's wafer bonding equipment achieves the highest yields for aligned wafer bonding in the industry.

MEMS Microphone.

光学微影技术

第一层封装技术

The main goal of assembly and packaging operations is to either attach the two halves of a device together (generally used in bulk micro machined sensors) or to provide a protective cover (common for surface machined parts). Sealing a MST device at wafer level provides a high level of cleanliness as it is performed prior to dicing. Particle sensitive MST features could not be diced without protection as cleaning of the chips after dicing is not very effective. In the case of surface micro machined technology, bonding a cap wafer to a sensor wafer provides the required protection for subsequent, less clean process steps. Surface micro machined features are often first level packaged at the wafer level to protect the sensitive, mechanically suspended features from the environment.  

Yaw rate sensor. Courtesy of Robert Bosch Gmbh.

Acceleration sensor. Courtesy of Robert Bosch Gmbh.