Vacuum reflow soldering（Reflow soldering oven）
Applications
Heating in vacuum and inert gas, Power semiconductors on heat sinks, Flip chip reflow, Melting of bumps, High intensity LED attach, Sealing of hermetic packages, Photovoltaic cell assembly, Die attach, Sintering of printed copper films, Assembly of hybrid circuits, Encapsulation of flat packs, MEMS and opto devices, Automotive sensors and high energy batteries, etc.
Specifications:
Process environment: nitrogen, inert gas, formic acid
Heating plate: size 260 x 210 mm
Clearance vertical: 80mm between bottom and top heating,
60mm above the heating plate
Chamber lid: manual operation with lid lock
Viewing port: Ø80mm
Maximum temperature: 650°C, Control deviation: +/- 0.5°C
Heating elements: 8x/16x infrared heating lamps in one/two rows
Ramp heat up max.: 250°C/minute
Ramp cool down max.: 250°C/minute
Temperature measurement and control: up to 4x K-Type thermocouples freely positional
Heating control: Individual power control with adjustable power gain on every heating lamp
Integrated overheat protection: electrical thermostat
Vacuum measurement: integrated vacuum gauge down to 5mbar
Process gas lines with digital flow meters: L1: 50slm, L2: 50slm, L3 via bubbler: 10slm, Cooling: 200slm
Formic acid bubbler: 40 ml container on the front panel with manual refill port
Chamber cooling: water cooling. External chiller or facility cooling is required
Vacuum pump: optional
Interfaces: PC Software for process logging, file transfer; External user interface for remote control 
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