MPS - Manual Placer System • Epoxy & Reflow solution • High accuracy • Very deep access • Flip alignment • User friendly
PP-ONE Automated XZ • Full automated process • Wafer sorter • Epoxy process • Prototype & production platform
WB300 Ultrasonic & Reflow Die Bonder • Automated Z Axis • Manual placer • Very small chips and heavy duty • Touch screen • Flip alignment • Thermosonic
PP6 Universal Die Bonder Documentation • All process • Face up & Face down • Z control • Programmable X&Y positions • Very high accuracy
PP7 3D Documentation • Placement of delicate devices on multi level reference package • Motorized UHD Camera • Multiple height process /programmable references
