UV-KUB 2 - UV-LED MASKING SYSTEM

An UV-LED masker with an unrivalled collimation perfomance

The exposure and masking system UV-KUB 2, available in 4" or 6" version, is the first UV-LED masking system available on the international market. The UV-KUB 2 is a compact exposure-masking system equipped with a LED based optical head, collimated and homogeneous.

Its masking function enables to reach resolutions down to 1µm. This system is compatible with any of the most popular photoresists such as AZ series, Shipley series, SU-8 and K-CL series.

UV-KUB 3 - NEW GENERATION OF MASK ALIGNER

First compact system with UV-LED light source

The mask aligner UV-KUB 3 is the first mask alignment system equipped with a UV-LED light source, that provide an unrivalled collimation and homogeneous exposure, on the international market.

Compact, easy to use and efficient, the mask alignment system UV-KUB 3 allows alignment up to 7" photolithography mask with substrates up to 6" in a cube volume of 48cm size.

Thanks to its removable photomask holder, the handling of fragile mask is considerably reduced: you can change the substrate as often as you want without touching the photomask.

Compatible with all standard photoresists: AZ, Shipley, SU8 and K-CL

UV-KUB 9 - INSOLATOR HIGH-POWER DENSITY

UV high powered system for large surface exposure

The large surface exposure system UV-KUB 9 is a cold-UV exposure system based on LED technology emitting a high power density, homogeneous and monochromatic illumination (200mW/cm² +/- 5%) at 365nm over a working surface of 9 inches.

It is the ideal equipment for applications like wafer bonding, temporary bonding and blue tape exposure used for dicing microelectronic wafers, especially issued from grinding technologies.

K-ILU 2 - UV-LED CURING ADHESIVE SYSTEM

UV-LED system for small surface

The adhesive curing system, the K-ILU 2 is an UV-LED adhesive curing, touchscreen controlled, offering continuous or flashing programmable curing modes.

The integrated cold-UV concept ensures very low-stress bondings, essential to any pigtailing and optical assembling processes.